TSV 3D RF Integration - High Resistivity Si Interposer Technology...

 TSV 3D RF Integration : High Resistivity Si Interposer Technology (True ePUB) https://CourseWikia.com English | 2022 | ISBN: 0323996027 | 294 Pages | True ePUB | 73 MBTSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed nstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed nstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.